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Resin-bond-grinding-wheels

1A8/1 the cylindrical without water slot

Product Description

Resin bond diamond Dicing Blades is mainly used for semicinductor, optical glass, quartz glass, ceramincs ect.

Application

For semicinductor component(QFN, PQFN), which can avoid burrs, and improve efficiency and life.

For optical glass, which can avoid chios and improve yield.

For quartz glass, which can avoid chios and improve efficiency, and finish of product.

For ceramics, which can avoid chips and cracks, and improve the processing quality.

Other material, such as slotting and cutting of crystal, magnetic materials, carbide and some other difficult to cut metal materials with excellent cutting quality .

Type of Hubless metal bond diamond saw blade

The models of diamond saw blade divide into 1A8/1 type without water slot and 1A8/2 type with water slot.

1A8/1 the cylindrical without water slot 1A8/2 the cylindrical with water slot

Specification of diamond Dicing Bladesmm

D50~6060~76.277~101.6102~125125~153Thickness tolerance
T     0.005
0.07     
0.1     
0.2     
0.3     
0.4     
0.5     
1.0     0.008
1.5     
2.0     
H25.431.75405269.87588.9114.3

Other specification can be made according to customers requirements. Email: [email protected]